TSMC
Production of chips using leading-edge process technologies requires more compute power than ever. To address requirements of 2nm nodes and beyond, NVIDIA is rolling out its cuLitho software library that uses the company's DGX H100 systems based on H100 GPUs and promises to increase performance available to mask shops within a reasonable amount of consumed power by 40 times. Modern process technologies push wafer fab equipment to its limits and often require finer resolution than is physically possible, which is where computational lithography comes into play. The primary purpose of computational lithography is to enhance the achievable resolution in photolithography processes without modifying the tools. To do so, CL employs algorithms that simulate the production process, incorporating crucial data from ASML's equipment and shuttle (test...
TSMC's 3nm Journey: Slow Ramp, Huge Investments, Big Future
Last week, TSMC issued their Q4 and full-year 2022 earnings reports for the company. Besides confirming that TSMC was closing out a very busy, very profitable year for the...
30 by Anton Shilov on 1/17/2023
TSMC Unveils Major U.S. Fab Expansion Plans: 3nm and $40 Billion by 2026
TSMC this week held its Arizona fab 'first tool-in' ceremony, where alongside celebrating its first US fab, the company also announced major expansion plans for the production facility. The...
17 by Anton Shilov on 12/7/2022
TSMC Forms 3DFabric Alliance to Accelerate Development of 2.5D & 3D Chiplet Products
Currently the majority of high-end processors are monolithic, but design methodologies are slowly but surely shifting to multi-chiplet modules as leading-edge fabrication technologies get more expensive to use. In...
9 by Anton Shilov on 10/27/2022
TSMC and ASML: Demand for Chips Remains Strong, But Getting Fab Tools Is Hard
TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are...
13 by Anton Shilov on 7/21/2022
TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later
When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two...
16 by Anton Shilov on 6/29/2022
TSMC to Customers: It's Time to Stop Using Older Nodes and Move to 28nm
We tend to discuss leading-edge nodes and the most advanced chips made using them, but there are thousands of chip designs developed years ago that are made using what...
20 by Anton Shilov on 6/29/2022
As HPC Chip Sizes Grow, So Does the Need For 1kW+ Chip Cooling
One trend in the high performance computing (HPC) space that is becoming increasingly clear is that power consumption per chip and per rack unit is not going to stop...
40 by Anton Shilov on 6/27/2022
TSMC to Expand Capacity for Mature and Specialty Nodes by 50%
TSMC this afternoon has disclosed that it will expand its production capacity for mature and specialized nodes by about 50% by 2025. The plan includes building numerous new fabs...
13 by Anton Shilov on 6/16/2022
TSMC Unveils N2 Process Node: Nanosheet-based GAAFETs Bring Significant Benefits In 2025
At its 2022 Technology Symposium, TSMC formally unveiled its N2 (2 nm class) fabrication technology, which is slated to go into production some time in 2025 and will be...
24 by Anton Shilov on 6/16/2022
TSMC Readies Five 3nm Process Technologies, Adds FinFlex For Design Flexibility
Taiwan Semiconductor Manufacturing Co. on Thursday kicked off its 2022 TSMC Technology Symposium, where the company traditionally shares it process technology roadmaps as well as its future expansion plans...
44 by Anton Shilov on 6/16/2022
AMD's Desktop CPU Roadmap: 2024 Brings Zen 5-based "Granite Ridge"
As part of AMD's Financial Analyst Day 2022, it has provided us with a look at the company's desktop client CPU roadmap as we advance towards 2024. As we...
37 by Gavin Bonshor on 6/9/2022
ASML High-NA Development Update: Coming to Fabs in 2024 - 2025
It took the semiconductor industry over a decade to prep everything needed for production of chips using extreme ultraviolet (EUV) lithography. It looks like it is going to take...
8 by Anton Shilov on 5/26/2022
TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming
Taiwan Semiconductor Manufacturing Co. has solid plans for the next few years, but the foundry's manufacturing technology design cycles are getting longer. As a result, to address all of...
21 by Anton Shilov on 4/22/2022
Universal Chiplet Interconnect Express (UCIe) Announced: Setting Standards For The Chiplet Ecosystem
If there has been one prominent, industry-wide trend in chip design over the past half-decade or so, it has been the growing use of chiplets. The tiny dies have...
25 by Ryan Smith on 3/2/2022
AMD: We’re Using an Optimized TSMC 5nm Process
When AMD started using TSMC’s 7nm process for the Zen 2 processor family that launched in November 2019, one of the overriding messages of that launch was that it...
44 by Dr. Ian Cutress on 1/10/2022
TSMC Unveils N4X Node: Extreme High-Performance at High Voltages
TSMC this week announced a new fabrication process that is tailored specifically for high-performance computing (HPC) products. N4X promises to combine transistor density and design rules of TSMC's N5-family...
42 by Anton Shilov on 12/17/2021
Semi CapEx to Hit $152 Billion in 2021 as Market on Track for $2 Trillion by 2035
Semiconductor makers have drastically increased their capital expenditures (CapEx) this year in response to unprecedented demand for chips that is going to last for years. Now the CEO of...
8 by Anton Shilov on 12/17/2021
AMD Gives Details on EPYC Zen4: Genoa and Bergamo, up to 96 and 128 Cores
Since AMD’s relaunch into high-performance x86 processor design, one of the fundamental targets for the company was to be a competitive force in the data center. By having a...
36 by Dr. Ian Cutress on 11/8/2021
TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025
TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting...
32 by Anton Shilov on 10/18/2021
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