Semiconductors
As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that it remains on track to meeting its goal of starting mass production of chips on its SF3 (3 nm-class, 2nd Generation) technology in the second half of the year. Meanwhile in June, Samsung Foundry will formally unveil its SF2 (2 nm-class) process technology, which will offer a mix of performance and efficiency enhancements. Finally, the company the company is preparing a variation of its 4 nm-class technology for integration into stacked 3D designs. SF2 To Be Unveiled In June Samsung plans to disclose key details about its SF2 fabrication technology at the VLSI Symposium 2024 on June...
Intel Sells a 20% Stake in Maker of Multi E-Beam Mask Writing Tools
Intel on Wednesday announced that it had agreed to sell a 20% stake in IMS Nanofabrication, a company the develops and builds multi e-beam photomask writing tools, for $860...
1 by Anton Shilov on 6/22/2023
Intel to Spend Tens of Billions on New Fabs in Germany and Israel
Intel is spending tens of billions of dollars on new fabs in Arizona and Oregon, but the company's ambitions certainly do not end in the U.S. This month the...
28 by Anton Shilov on 6/21/2023
Top 10 Foundries See Revenue Drop Nearly 15% Year-over-Year
The top 10 contract makers of chips saw their Q1 2023 revenue decline by 14.6% year-over-year and 18.6% quarter-over-quarter, according to the most recent report by TrendForce. The market...
0 by Anton Shilov on 6/13/2023
TSMC Opens Advanced Backend Packaging Fab for AI and HPC Products
TSMC on Friday formally opened its Advanced Backend Fab 6 facility, which it will be using to expand the company's capacity for building high-end, multi-chiplet products. The facility is...
1 by Anton Shilov on 6/9/2023
TSMC Shares More Info on 2nm: New MIM Capacitor and Backside PDN Detailed
TSMC has revealed some additional details about its upcoming N2 and N2P process technology at its European Technology Symposium 2023. Both production nodes are being developed with high-performance computing...
15 by Anton Shilov on 5/31/2023
TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors
As part of their efforts to push the boundaries on the largest manufacturable chip sizes, Taiwan Semiconductor Manufacturing Co. is working on its new Chip-On-Wafer-On-Substrate-L (CoWoS-L) packaging technology that...
2 by Anton Shilov on 5/26/2023
TSMC Details N4X Process for HPC: Extreme Performance at Minimum Leakage
At its 2023 Technology Symposium TSMC revealed some additional details about its upcoming N4X technology that is designed specifically for high-performance computing (HPC) applications. This node promises to enable...
5 by Anton Shilov on 5/26/2023
TSMC: We Have Working CFET Transistors in the Lab, But They Are Generations Away
Offering an update on its work with complementary field-effect transistors (CFETs) as part of the company's European Technology Symposium 2023, TSMC has revealed that it has working CFETs within...
3 by Anton Shilov on 5/25/2023
Samsung to Unveil Refined 3nm and Performance-Enhanced 4nm Nodes at VLSI Symposium
Samsung Foundry is set to detail its second generation 3 nm-class fabrication technology as well as its performance-enhanced 4 nm-class manufacturing process at the upcoming upcoming 2023 Symposium on...
3 by Anton Shilov on 5/10/2023
Samsung Foundry Vows to Surpass TSMC Within Five Years
The head of Samsung's semiconductor unit acknowledged last week that the company's current mass production, leading-edge process technologies are a couple of years behind TSMC's most advanced production nodes...
18 by Anton Shilov on 5/8/2023
TSMC Announces Early Access Nodes for Next-Gen Car Chips: N4AE and N3AE
As the final set of announcements from this week's North American Technology Symposium, TSMC closed out their fab roadmap updates with some fresh news on their automotive-centric processes. For...
10 by Anton Shilov on 4/28/2023
TSMC Details 3nm Evolution: N3E On Schedule, N3P and N3X To Deliver 5% Performance Gains
Alongside some new announcements for their 2nm process node plans, TSMC has also released a progress and roadmap update for their N3 family process technologies at today's 2023 North...
13 by Anton Shilov on 4/26/2023
TSMC Outlines 2nm Plans: N2P Brings Backside Power Delivery in 2026, N2X Added To Roadmap
At its 2023 North American Technology Symposium today, TSMC has disclosed additional details about its plans for its forthcoming N2 2nm-class production nodes in 2025 – 2026 and beyond...
38 by Anton Shilov on 4/26/2023
GlobalFoundries Sues IBM Over Sharing Leading-Edge Chip IP with Intel, Rapidus
The relationship between GlobalFoundries and IBM has been rocky in recent years. Among other things, Big Blue has previously sued GF, seeking damages for abruptly stopping the development of...
10 by Anton Shilov on 4/20/2023
Synopsys Intros AI-Powered EDA Suite to Accelerate Chip Design and Cut Costs
Synopsys has introduced the industry's first full-stack AI-powered suite of electronic design automation tools that covers all stages of chip design, from architecture to design and implementation to manufacturing...
12 by Anton Shilov on 3/30/2023
NVIDIA's cuLitho to Speed Up Computational Lithography for 2nm and Beyond
Production of chips using leading-edge process technologies requires more compute power than ever. To address requirements of 2nm nodes and beyond, NVIDIA is rolling out its cuLitho software library...
31 by Anton Shilov on 3/27/2023
Gordon Moore, Intel's Co-Founder and Tech Industry Visionary, Passes Away At 94
Intel and the Gordon and Betty Moore Foundation have announced this evening that Gordon Moore, Intel’s famous co-founder and grandfather to much of the modern chip industry, has passed...
20 by Ryan Smith on 3/24/2023
Out With Organic, In With Glass? DNP Unveils Glass Core Substrate Tech For Chips
As the chip industry develops more sophisticated processors with higher heat dissipation requirements, some firms have moved on to chiplet-based designs. This not-so-gradual shift has resulted in chip packaging...
17 by Anton Shilov on 3/23/2023
Inflation Drives Up Fab Costs for Intel and Samsung by Billions of Dollars
To address future demand for semiconductors amid severe chip shortages of 2020 – 2022, all leading chipmakers announced plans to build new fabs and even disclosed their estimated costs...
15 by Anton Shilov on 3/16/2023
Samsung Seeks to Make South Korea No. 1 Chipmaker with $230B Investment Over 20 Years
Samsung on Wednesday unveiled their plan to invest $230 billion over the next 20 years in a new semiconductor production mega cluster in South Korea. The country's government believes...
22 by Anton Shilov on 3/15/2023
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